3D-MID process steps
FOR HIGH VOLUMES
MICRO-FINE AND SUPER FLEXIBLE
CONDUCTORS ON TOP
HARTING has qualified various connection technologies at hand such as SMD placement, chip assembly, the combination of MID and PCBs or MID and connectors. These capabilities expand your MID component to form a complete sub-assembly.
The choice of connection technology depends on product design. Joining forces with you, we will decide which solution suits your product.
SMD (surface-mounted device) placement utilises soldering or conductive adhesives.
The technique preferred for MID is vapour phase soldering. This achieves homogeneous temperature distribution across the module, also with three-dimensional geometries.
We use conductive adhesives as an alternative connection technology. In particular, it is used as an alternative for materials unsuitable for soldering or when the assembly sequence makes the respective demands.
3D-MID metallises by building tracks additively as thermoplastic materials cannot be metallised directly using galvanic processes due to their insulating properties.
For this purpose, HARTING has built one of the largest, most modern metallisation plants especially for 3D-MID in Biel in Switzerland’s Seeland region. Besides the standard copper-nickel-gold layer system, this plant offers various extension options for other finished surfaces and is specially attuned to the requirements of the 3D-MID processes of laser direct structuring and two-component injection moulding. Depending on the size and geometry, the metallisation takes place in a barrel or frame.
In the LPKF-LDS® additive process, structuring is achieved by means of a laser beam which exposes and activates special additives in the plastic.
The infrared laser light forms a microrough surface in irradiated areas with metal particles and microcavities. The metal particles are altered by the laser energy in such a way that they act as a catalyst in the following metallisation step and result in selective metal deposition. The roughness provides optimum adhesion for the conductive tracks.
In general, MID technology processes do not differ from conventional plastics engineering. In order to ensure high quality, it is essential to prepare materials accordingly, take account of production-related effects and adapt further processing following the injection moulding process.
Thanks to our extensive experience with products from a wide range of sectors and industries, we are prepared for all eventualities as part of our in-house production chain.
"You have a production
challenge for us? Accepted!"
Head of PM, Product &