We are also elevating switches to new functional heights thanks to 3D-MID technology. Drawing on 3D-MID technology, switches are integrated with an injection-moulded housing. This process allows us to make parts more compact, while increasing their functional density.
3D-MID opens up many new possibilities for the use of switches – as exemplified by the creation of capacitive surfaces that can be attached directly to a housing.
Matthias Zenker
Project Manager &
Technology Development
Francois Roncoroni
Market & Product Manager
Hollie Finnegan
Product & Applications Manager
Claudio Sonzogni
Product & Application Manager
Stephan Schmidt
MID Sales North America
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