Enabling 3D-Placement Of Electronic Components
Modern electronic assemblies are becoming more and more complex with an increasing number of components. This makes it difficult to fit all parts into the limited space available for printed circuit boards (PCBs). To meet these challenges, engineers are using miniaturized components and flexible or rigid-flex PCBs. However, a very strong trend is 3D packaging. Are you curious whether the chip carrier from HARTING also offers many advantages for your product?